New Generation Heatsink Assembly
for Press Pack type Semiconductors.
Note that the top and bottom Heatsinks
are actually a network doubling the effective fin area on the Heatsink.Each
Web is connected by Heat Pipes making
the network isothermal.
In an application with 1500 LFM air flow,
an improvement of about 30% can be expected. This is an important advancement in Thermal Management
for Press Pack type Semiconductors.
Note that the top and bottom Heatsinks
are actually a network doubling the effective fin area on the Heatsink.Each
Web is connected by Heat Pipes making
the network isothermal.
In an application with 1500 LFM air flow,
an improvement of about 30% can be expected. This is an important advancement in Thermal Management
AALLpower Heatsinks Inc.
Home of New Generation Heat Sinks
